Flexible Plate Processing Ability-Dongguan Kangyuan Electronics
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Flexible Plate Processing Ability

 



Features

FPC Capabilities

Layers

1 to 6 layers (Flex Board)
2 to 12 layers (Rigid-Flex Board)

Normal Base Materials

PI、PET、 LCP

Normal BaseCore Thickness

12.5μm、20μm、25μm、 50μm for Flex

Normal  Coverlay Thickness

25μm-75μm

Normal Adhesive Thickness

12.5-50μm

       Base Copper Thickness12-70μm RA Copper
6-35μm ED Copper

Stiffener Materials

PI, PET, FR4, SUS, Al-plate, Cu-plate,Ceramic

Min. Finished Thickness

60µm/2.4mil( 1 layer FPC )
96µm/3.8mil( 2 layers FPC)

250µm/10mil( 4 layers )
350µm/13.8mil( 6 layers )

Max. Panel Size

250mm*500mm/10inch*20inch

Min. Drill bit Diameter

125µm/5mil(Mechanical Drill)

75µm/3mil(CO2 Laser Drill)

25µm/1mil(UV Laser Drill)

Min. Line Width/ Space

30μm / 30μm

Outline Fabrication

Precision Punching & CNC Routing & CNC Milling & Laser Cutting

Surface Finish

1) Plated Gold ( Flash, Hard or Soft Gold)

2) ENIG(Soft nickel)

3) ENEPIG(Soft Nickel or Hard Nickel)

4) O.S.P

5) Hot Air Solder Leveling (lead-free)

6) Immersion Tin / Plating Tin

7) Silver Ink 

 

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