IC substrate capability-Dongguan Kangyuan Electronics
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Research Capability Cooperation Patent Layout

IC substrate capability

Features

IC substrate capability

Min. Finished Thickness

100μm (2 layers)

180μm (4 layers)

260μm (6 layers)

Min. Through hole size/pad size

100um/200um

Min. Blind hole size/pad size

55um/115um

Min. Line Width/Space

25um/25um

Surface Finish

1)Soft Gold

2) ENIG

3) ENEPIG

4) O.S.P

Process

Tenting

Etch Back

Buss-less

MSAP


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